Surface Mount Device Package Types

The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices.

Surface mount device package types. Surface mount device or smd is the term used for the electronic components used within the surface mount assembly process. Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame. It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. Ceramic flat pack clga.

Surface mount device package types. Bumpered quad flat pack cabga ssbga. A very large number of different types of package exist. As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases.

Bump chip carrier bga. Micro surface mount device extended technology. There is a wide range of smd component packages available on the market and come in many shapes and sizes a selection can be seen below. Surface mount device package types soic package.

Ceramic pin grid array cpga graphic cqfp. Ceramic land grid array see lga cpga. A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case. Ceramic ball grid array cfp.

Concurrently as the device complexity increases the heat generated by operation. The small outline integrated circuit soic plastic package is shown above.